发明名称 COMPOSITION AND METHOD FOR PRODUCING COPPER FILM
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a copper film having a predetermined pattern even without any etching step, and to provide a composition usable for the above method. SOLUTION: The composition comprises copper-based powder and water-glass. The method for producing the copper film comprises applying the above composition on a board by e.g. a printing technique such as screen printing technique or ink-jet technique, a spin-coating technique, a pattern-forming method using a dispenser, a spraying technique, and then baking the composition in a vacuum or inert gas at 300°C or higher. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009013262(A) 申请公布日期 2009.01.22
申请号 JP20070175453 申请日期 2007.07.03
申请人 TOSOH CORP 发明人 INAO TOSHIO;TOIDA YOSHIHARU
分类号 C09D1/02;H01B13/00;H01L21/28;H01L21/288 主分类号 C09D1/02
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