| 摘要 |
PROBLEM TO BE SOLVED: To provide silver paste which can be baked at 200°C or lower after printing fine wiring and can attain favorable printability and the adhesion of a baked film to a substrate. SOLUTION: The silver paste contains first-grade amine coated silver particles of 4 to 20 mm of a mean particle size D<SB>TEM</SB>and their dispersion mediums. The silver particle has a particle size distribution of 40% or smaller in CV value defined by an equation of CV value =100×[particle size standard deviationσ<SB>D</SB>]/[mean particle size D<SB>TEM</SB>], and is 20 to 100 Pa*S in viscosity. The first-grade amine of a boiling point of 70 to 380°C is used. As the dispersion medium, hydrocarbon or a higher alcohol of 100 to 300 in molecular weight and 180 to 300°C in boiling point is used. The concentration of silver in a paste composition is favorably 70 to 90% by mass. COPYRIGHT: (C)2009,JPO&INPIT
|
