THERMALLY CONDUCTIVE UNDERFILL FORMULATIONS

摘要

A thermally conductive composition particularly well suited for use as an underfill composition including a curable resin and filler particles having an average diameter of less than 25 microns, wherein the filler particles are present in an amount sufficient to provide a thermal conductivity of greater than 0.5 W/mK and a viscosity of less than 0.600 Pa. s at 90°C as measured with a 20mm parallel plate at shear rate of 30 1/s.