发明名称 RESIN FOR HEAT IMPRINT, RESIN SOLUTION FOR HEAT IMPRINT, INJECTION-MOLDED ARTICLE FOR HEAT IMPRINT, THIN FILM FOR HEAT IMPRINT, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resin for heat imprint with low resin modulus of elasticity at fluidization and sufficient fine pattern transferring property excellent in thermal deterioration resistance in order to suppress generation of a particulate substance in fine processing by heat imprint, a resin solution for heat imprint using the resin, an injection molded body for heat imprint using the resin, a thin film for heat imprint using the resin, and its manufacturing method. SOLUTION: In the resin for heat imprint, in measurement of a differential scanning calorimeter at temperature-elevation speed of 5°C/min in air, an exothermic initiation temperature (oxidation initiation temperature) of an exothermic peak accompanying oxidation is a temperature of the glass transition temperature of the resin +35°C or higher, and in measurement of dynamic visco-elasticity at a frequency of 1 rad/sec in a nitrogen stream, complex modulus of elasticity at a temperature of the glass transition temperature of the resin +35°C is less than 0.24 MPa. Further, the resin solution for heat imprint using this, the injection molded body for heat imprint, the thin film for heat imprint and its manufacturing method are provided. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009013277(A) 申请公布日期 2009.01.22
申请号 JP20070176062 申请日期 2007.07.04
申请人 MARUZEN PETROCHEM CO LTD;SCIVAX KK 发明人 SAZUKA TAKUO;TAKATANI YOSHITERU;KUSUURA TAKAHISA;MITRA ANUPAM
分类号 C08F32/08;B05D1/40;B29C59/02 主分类号 C08F32/08
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