发明名称 CONNECTING MECHANISM AND SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a connecting mechanism and a substrate treatment device, capable of mutually connecting objects to be connected in a short time with high connecting strength, and saving the space for the connecting part. SOLUTION: Since a connecting member for connecting a first bracket 4 to a second bracket 5 includes a protruding part 4a is provided to be engaged with a protruding part 4a provided on the first bracket 4 and a protruding part 5a provided on the second bracket 5, the first bracket 1 and the second bracket 5 can be connected to each other through each of the protruding parts 4a and 5a with high connecting strength. Since the first bracket 4 and the second bracket 5 can be connected to each other by engaging the connecting member with the protruding parts 4a and 5a, the connection can be performed in a short time. Further, since only the space for engagement with each protruding part 4a, 5a suffices for the connecting member, the space for the connecting part can be saved. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009014140(A) 申请公布日期 2009.01.22
申请号 JP20070178408 申请日期 2007.07.06
申请人 IHI CORP 发明人 SHINAGAWA MIKI
分类号 F16B2/06;F16B5/00;F16B5/02;H01L21/205;H01L21/3065 主分类号 F16B2/06
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