| 发明名称 |
Method of forming a crack stop void in a low-k dielectric layer between adjacent fuses |
| 摘要 |
A crack stop void is formed in a low-k dielectric layer between adjacent fuse structures for preventing propagation of cracks between the adjacent fuse structures during a fuse blow operation. The crack stop void is formed simultaneously with the formation of an interconnect structure.
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| 申请公布号 |
US7479447(B2) |
申请公布日期 |
2009.01.20 |
| 申请号 |
US20060277398 |
申请日期 |
2006.03.24 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAUBENSPECK TIMOTHY H.;MUZZY CHRISTOPHER D.;MCLAUGHLIN PAUL S.;WRIGHT JUDITH A.;WYNNE JEAN E.;JUNG DAE YOUNG |
| 分类号 |
H01L21/44;H01L29/00 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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