| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser scribing method for dividing a substrate to be divided without producing babbles which is formed by bonding quartz substrates through an adhesive layer. <P>SOLUTION: A substrate 4 to be divided is formed by bonding quartz substrates 1, 2 through the adhesive layer 3. The parts of the quartz substrates 1, 2 are irradiated with a laser beam through a laser beam irradiation device 10 to generate reforming zones. By forming the reforming zones in a predetermined area, the substrate 4 is made to be dividable. In this case, the thicknesses of the quartz substrates 1, 2 are detected in a non-contact manner before irradiating a laser beam through a laser beam irradiation device 10. A position of the adhesive layer 3 is detected from the detected thicknesses of the quartz substrates 1, 2. A condensing position of a laser beam and aberration correction are set such that a condensing region does not lie across the detected position of the adhesive layer 3. On the basis of the condensing position and aberration correction, a laser beam is irradiated through the laser beam irradiation device 10. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
