发明名称 POLYAMIDEIMIDE RESIN AND ADHESIVE COMPOSITION USING IT
摘要 PROBLEM TO BE SOLVED: To provide a polyamideimide resin showing a high glass transition temperature without respect to a value of modulus. SOLUTION: This polyamideimide resin, which has an organosiloxane skeleton, is obtained by reaction between a diimide-dicarbonic acid and a diisocyanate compound. The diimide-dicarbonic acid is obtained by reaction between a diamine compound containing siloxane diamine, wherein an aromatic ring is bound to a part of an Si atom of the organosiloxane skeleton, as an essential constituent and a tricarbonic acid anhydride. When mass of the aromatic ring contained in the polyamideimide is represented by A and mass of an amide group of the polyamideimide resin is represented by B, a value of A/B is 7.05 or more, and the siloxane diamine is represented by a general formula (15) (in the formula, y and z represent integers of 1-50). COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009007580(A) 申请公布日期 2009.01.15
申请号 JP20080208105 申请日期 2008.08.12
申请人 HITACHI CHEM CO LTD 发明人 TANAKA HIROKO;TAKEUCHI KAZUMASA;MASUDA KATSUYUKI
分类号 C08G73/14;C09J179/08;C09J201/00;C09J201/02 主分类号 C08G73/14
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