发明名称 BASE MATERIAL WITH JUNCTION FILM, METHOD OF JOINING AND JUNCTION STRUCTURE
摘要 <p>A base material with junction film comprising a base sheet (base material) and, superimposed on the base sheet, a junction film so as to be joinable with an opposite base sheet (another adherend). This junction film contains an Si skeleton of random atomic arrangement having a siloxane (Si-O) bond and an eliminable group bonded to the Si skeleton, produced by a plasma polymerization technique. This junction film when exposed to ultraviolet radiation has its eliminable group eliminated from the Si skeleton, so that adherence to the opposite base sheet is developed on the surface of the junction film.</p>
申请公布号 WO2009008309(A1) 申请公布日期 2009.01.15
申请号 WO2008JP62008 申请日期 2008.07.02
申请人 SEIKO EPSON CORPORATION;MATSUO, YASUHIDE;OTSUKA, KENJI;HIGUCHI, KAZUO;WAKAMATSU, KOSUKE 发明人 MATSUO, YASUHIDE;OTSUKA, KENJI;HIGUCHI, KAZUO;WAKAMATSU, KOSUKE
分类号 B32B9/00;C09J5/02;B41J2/16;H01L21/02;H01L27/12 主分类号 B32B9/00
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