发明名称 CONSTRUCTIVE ARRANGEMENT APPLIED TO A MODULAR STRUCTURAL PANEL AND METHOD OF PREPARING THE SAME
摘要 <p>The present invention refers to a constructive arrangement applied to a modular structural panel, which is used in situations where a higher resistance to impacts, thermal variations, and action of water is desired, being an environmentally friendly product, provided with characteristics required for green buildings. Said panels are intended for use in the furniture industry and in civil construction. The structured assembly of the present embodiment keeps itself joined by means of a specific adhesive material, which is able to give to said assembly the essential and unique characteristics for its various intended applications.</p>
申请公布号 WO2009006716(A1) 申请公布日期 2009.01.15
申请号 WO2008BR00193 申请日期 2008.07.07
申请人 ADESPEC ADESIVOS ESPECIAIS S.A.;CHEN, WANG SHU 发明人 CHEN, WANG SHU
分类号 E04C2/288;B32B13/12 主分类号 E04C2/288
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