发明名称 SEMICONDUCTOR DEVICE
摘要 A semiconductor device includes a first semiconductor layer and a first semiconductor element located in the first semiconductor layer. The semiconductor device also includes a second semiconductor layer of a transparent semiconductor material. The second semiconductor layer is disposed on the first semiconductor layer covering the first semiconductor element. The semiconductor device also includes a second semiconductor element located in the second semiconductor layer. The semiconductor device also includes a wire extending within the second semiconductor layer and electrically connecting the first and second semiconductor elements.
申请公布号 US2009014728(A1) 申请公布日期 2009.01.15
申请号 US20070955672 申请日期 2007.12.13
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 KOYAMA HIDETOSHI;KAMO YOSHITAKA
分类号 H01L29/12 主分类号 H01L29/12
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