SUBSTRATE SUPPORT MEMBER AND METHOD FOR TREATING SUBSTRATE WITH THE SAME

摘要

The substrate support member and a method for treating the substrate with the same are provided to prevent the wafer from being damaged by lifting down the lift pin by the controller if the pressure value of driver deviates from the set pressure value. The wafer is loaded in the substrate processing apparatus(S110). If the wafer is loaded on the lift pin, the controller controls the driver and drops the lift pin member to settle the wafer in the holding surface of the supporting body. If the wafer is settled in the substrate support member, the process of forming the thin film on the wafer is performed(S120). If the inner pressure of housing is risen to the atmosphere pressure, the controller operates the driver to raise the lift pin member(S130). The pressure meters measures the inner pressure of driver.