COMPRESSION MOLDING APPARATUS AND MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: To seal a product with a molding resin without accompanying variations in the thickness of the resin layer in simple manner in a compression molding apparatus. CONSTITUTION: This compression molding apparatus seals one surface of a product 30 having a plurality of posts 18 thereon with a molding resin 16. This apparatus comprises an upper mold 42 and a lower mold 44, which are movable toward each other for forming a cavity 46 for locating the product 30 therein. One of the upper and lower molds 42 and 44 has a dummy cavity 48, that surrounds and communicates with the cavity 46.