The method for attaching the ball of the semiconductor package is provided to improve the adhesive coherence between the solder ball and voland by using solvent to left a part of flux. The flux(20) is dotted in the voland(10) of the substrate(100). Tthe solder ball(30) is located on the flux dotted in the voland of substrate. The reflow process for the fuse of the solder ball is performed. The flux surrounded with the whole surface of the solder ball is removed using the reflow process. The flux is left along the outer diameter portion of junction between the solder ball and the voland.
