| 摘要 |
This invention involves the technological area of plating, chemical electrodeposit of aluminum and aluminum copper radiator, referring specifically to some electrodeposit and chemical electrodeposit techniques of the partial chemical oxidation in aluminum and aluminum copper radiator. This invention is to conduct partial chemical oxidation and enclosure to the radiator before it undergoes the galvanization. It has to oxidize the non surfacing with chemical oxidation and cover a layer of porous film, and then utilize the sealing compound to fill up the holes of porous film, which makes the porous film form a layer of film against the erosion of acid and alkali, and connect the current existing chemical electrodeposit or electrodeposit techniques, only electrodeposit a wieldable nickel-phosphorus alloy in the connected part where the aluminum radiator or the aluminums and copper radiator with the main frame. This invention's technique only applies the chemical electrodeposit or electrodeposit to the surface that need electrodeposit in the radiator, which is simple and easy to be implemented, saving the expensive metal resource and reducing the product costs.
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