| 发明名称 |
ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD |
| 摘要 |
The adhesive sheet for manufacturing a semiconductor device is an adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, and is a peelable adhesive sheet in which the 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less. |
| 申请公布号 |
US2009001611(A1) |
申请公布日期 |
2009.01.01 |
| 申请号 |
US20070851963 |
申请日期 |
2007.09.07 |
| 申请人 |
|
发明人 |
MATSUMURA TAKESHI;MISUMI SADAHITO;HOSOKAWA KAZUHITO;KONDO HIROYUKI |
| 分类号 |
H01L23/52;H01L21/02 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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