发明名称 |
RESIN COMPOSITION AND COPPER FOIL WITH RESIN OBTAINED BY USING THE RESIN COMPOSITION |
摘要 |
<p>Disclosed is a resin composition which enables to form an insulating resin layer having adequate flame retardancy, while exhibiting good adhesion to a copper foil for printed wiring board production. Also disclosed is a copper foil with resin. Specifically disclosed is a resin composition for forming an insulating layer for printed wiring board, which is characterized by having a base composition containing a bisphenol epoxy resin having an epoxy equivalent of not more than 200 which is in a liquid state at 25°C as a component A, a linear polymer having a crosslinkable functional group as a component B, a crosslinking agent as a component C, 4,4'-diaminodiphenylsulfone or 2,2-bis(4-(4-aminophenoxy)phenyl)propane as a component D, a flame-retardant epoxy resin as a component E, and a polyfunctional epoxy resin as a component F.</p> |
申请公布号 |
WO2009001850(A1) |
申请公布日期 |
2008.12.31 |
申请号 |
WO2008JP61529 |
申请日期 |
2008.06.25 |
申请人 |
MITSUI MINING & SMELTING CO., LTD.;SATO, TETSURO;MATSUSHIMA, TOSHIFUMI;MATSUNAGA, TETSUHIRO |
发明人 |
SATO, TETSURO;MATSUSHIMA, TOSHIFUMI;MATSUNAGA, TETSUHIRO |
分类号 |
C08G59/56;C08G59/30;C08G59/32;H05K1/03 |
主分类号 |
C08G59/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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