| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sealing structure formed to joint an electronic component to a wiring substrate, which at once relaxes thermal stress and has humidity resistance and/or water resistance. <P>SOLUTION: In the sealing structure of an electronic component, a connecting electrode on a circuit board faces a connecting electrode of an electronic component, and a conductive connection part of conductive material is formed between both electrodes. A resin sealing part for sealing the conductive connection part is formed between the substrate surface and at least the lower side surface of the electronic component. The resin sealing part comprises at least two layers, an inside resin layer and an outside resin layer. The glass transition temperature of the inside resin layer is different from that of the outside resin layer. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
