| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiating mechanism and a heat radiating method for improving heat radiation efficiency without drop of insulating resistance voltage without requirement of an extra mounting space. SOLUTION: The heat radiating mechanism includes a printed circuit board 110, a heat radiating member 130 for radiating heat generated from a heat radiating body 120, and a heat radiating means 140 for transferring heat to the printed circuit board 110 from the heat radiating member 130. COPYRIGHT: (C)2009,JPO&INPIT
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