发明名称 |
METHOD FOR PRODUCTION OF METAL-COATED POLYIMIDE RESIN SUBSTRATE HAVING EXCELLENT THERMAL AGING RESISTANCE PROPERTY |
摘要 |
<p>Disclosed is a method for producing a metal-coated polyimide resin substrate, which comprises: forming an electroless nickel-plated layer containing a component (B) on both surfaces or one surface of a polyimide resin film; and forming an electrically conductive film on the surface of the electroless nickel-plated layer by the electroless copper plating or the electro copper plating. The method is characterized as follows. Prior to the electroless nickel plating, a treatment of immersing the polyimide resin substrate in a solution comprising an alkali metal hydroxide to thereby render the polyimide resin substrate hydrophilic, a catalyst addition treatment, and a catalyst activation treatment are conducted. The process for forming the electroless nickel layer is divided into two steps. In the first step, an electroless nickel-plated layer having a larger thickness than that formed in the second step is formed, and the resulting layer is subjected to a heat treatment. In the second step, a procedure for forming an electroless nickel-plated layer is conducted again. The method enables to increase the adhesion after thermal aging (i.e., after allowing to left in the atmosphere at 150°C for 168 hours) without deteriorating the initial adhesion which is a measure of the adhesion force of a non-adhesive flexible laminate.</p> |
申请公布号 |
WO2008152974(A1) |
申请公布日期 |
2008.12.18 |
申请号 |
WO2008JP60420 |
申请日期 |
2008.06.06 |
申请人 |
YOSHIDA, TAKU;NIPPON MINING & METALS CO., LTD.;KAWAMURA, TOSHIFUMI |
发明人 |
YOSHIDA, TAKU;KAWAMURA, TOSHIFUMI |
分类号 |
C23C18/52;B32B15/088;C23C18/20;H05K3/00;H05K3/38 |
主分类号 |
C23C18/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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