发明名称 SOLID STATE IMAGING APPARATUS, MANUFACTURING METHOD THEREOF, AND IMAGING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To simultaneously materialize a sufficient hole accumulation layer and dark current reduction. <P>SOLUTION: A solid state imaging apparatus 1 includes a light reception unit 12 which performs photoelectric conversion of an incident light. The solid state imaging apparatus 1 has a film 21 formed on a light reception surface 12s of the light reception unit 12 so as to lower the interface potential and a film 22 formed on the film 21 formed lowering the interface potential and having a negative fixed charge. A hole accumulation layer 23 is formed on the side of the light reception surface 12s of the light reception unit 12. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008306160(A) 申请公布日期 2008.12.18
申请号 JP20070333691 申请日期 2007.12.26
申请人 SONY CORP 发明人 IKEDA HARUMI;HIYAMA SUSUMU;ANDO TAKASHI;TABUCHI KIYOTAKA;YAMAGUCHI TETSUJI;OGISHI HIROKO
分类号 H01L27/146;H01L27/148;H01L31/00;H01L31/10;H04N5/335;H04N5/361;H04N5/369 主分类号 H01L27/146
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