发明名称 |
SOLID STATE IMAGING APPARATUS, MANUFACTURING METHOD THEREOF, AND IMAGING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To simultaneously materialize a sufficient hole accumulation layer and dark current reduction. <P>SOLUTION: A solid state imaging apparatus 1 includes a light reception unit 12 which performs photoelectric conversion of an incident light. The solid state imaging apparatus 1 has a film 21 formed on a light reception surface 12s of the light reception unit 12 so as to lower the interface potential and a film 22 formed on the film 21 formed lowering the interface potential and having a negative fixed charge. A hole accumulation layer 23 is formed on the side of the light reception surface 12s of the light reception unit 12. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008306160(A) |
申请公布日期 |
2008.12.18 |
申请号 |
JP20070333691 |
申请日期 |
2007.12.26 |
申请人 |
SONY CORP |
发明人 |
IKEDA HARUMI;HIYAMA SUSUMU;ANDO TAKASHI;TABUCHI KIYOTAKA;YAMAGUCHI TETSUJI;OGISHI HIROKO |
分类号 |
H01L27/146;H01L27/148;H01L31/00;H01L31/10;H04N5/335;H04N5/361;H04N5/369 |
主分类号 |
H01L27/146 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|