| 摘要 |
A semiconductor device wherein a chip (1) having a semiconductor element (2) formed on the surface thereof is fixed in a concave portion formed on a base member (7) and is sealed with a cover (8) at a predetermined spacing. The chip (1) includes (a) an insulating layer (3) formed on the semiconductor element (2), which layer possesses heat-resistance and a corpuscular dose coefficient of less than 0.1 p/cm<2>.hr, and (b) a radiation-shielding metal layer (4) formed on the insulating layer (3). Thus, the semiconductor element (2) is shielded from the radiation emitted from packaging members such as the base member (7) and the cover (8). As a result, the semiconductor device does not experience erroneous operation or a deterioration in the characteristics thereof. |
