发明名称 BAND-PLATING APPARATUS
摘要 <p>Bandplating apparatus, where any flexible synthetic bands or synthetic-coated and endless screening metal bands are arranged by their surfaces fitting to each other, moving on sides of the metal plate to be plated at synchronized speed. The endless screening bands move on guiding and conveyor discs which have fixed and adjustable shafts, the band being tensioned sufficiently for the drive. Two screening bands are mounted on the plating side of the metal band spaced from each other according to the strip width, tensioned independently from each other with three adjustable tensioning discs, thereby realizing the unilateral strip plating. A screening band with its surface fitting to the metal band moves on the plating side of the metal band, said screening band is provided with line of guide-holes and with openings corresponding to the spots to be plated. During the movement of the metal band to be plated and the screening band, the lines of guide-holes formed on them constantly cover each other, thereby realizing the unilateral spot plating. </p>
申请公布号 WO1981003187(A1) 申请公布日期 1981.11.12
申请号 HU1981000020 申请日期 1981.05.06
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