发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain the excellent characteristics for a chip when a large current is applied by a method wherein a flat wire is joined together in the direction of thickness and the strength and junction area of the chip are increased. CONSTITUTION:A supersonic junction is performed on an Al-Si metal wire having rectangular section and other metal wires 11e and 11b. A wire and an electrode have a flat surface, they have a large contact area and they have also a strong adhesive strength. According to this constitution, an emitter electrode can be replaced with a flat wire, for example, working hours can be reduced, and the percentage of rejects and the percentage of troubles in a long lifetime test can also be reduced.
申请公布号 JPS5948947(A) 申请公布日期 1984.03.21
申请号 JP19820158876 申请日期 1982.09.14
申请人 TOKYO SHIBAURA DENKI KK 发明人 OONO TADAAKI;FUJII YOSHIMICHI
分类号 H01L21/60;H01L23/495 主分类号 H01L21/60
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