HEAT PIPE TYPE DISSIPATOR FOR SEMICONDUCTOR

摘要

PURPOSE:To enhance forcibly convective heat dissipating efficiency of the fin part of a heat dissipator, and to enhance the faculty per volume of the enveloped body by a method wherein a group of heat pipes is arranged in an alternately crossed zigzag type toward the air flowing direction of the fin part. CONSTITUTION:Cupreous water heat pipes 2 are arranged in a parallel zigzag type, the heat absorbing parts 3 thereof are inserted in a semiconductor fitting aluminum block 1, and heat radiation fins 5 manufactured of aluminum are fitted to the heat radiation parts 4 of the heat pipes 2 projecting in a zigzag type from the block 1 to form a dissipator concerning to this invention having the heat pipes arranged in a one-stage parallel zigzag type. Arrangement of the heat pipes is made as follows for example. A pitch P1 in the right-angled direction to the air flowing direction is made to 8mm. ( the ratio to the diameter of the heat pipe is P1/D0=0.50), and the pitch P2 in the air flowing direction is made to 25mm. (the ratio to the diameter of the heat pipe is P2/D0=1.57).