| 摘要 |
<p>PURPOSE:To obtain a semiconductor device characterized by less internal stress, excellent moisture resistance and thermal shock resistance, and high reliability, by using a sealing resin provided with stabilized reduction ability of thermal stress. CONSTITUTION:A monomer, which can form a (metha) acrylic acid ester resin, whose glass transition temperature is less than a room temperature, and a monomer having an epoxy group are polymerized in an epoxy resin. A hardening agent, a filler and the like are added in said reacted product and kneaded. By using the resin composition, a required part to be sealed is sealed by transfer molding and the like. Then the epoxy group is included in the fine particles of the (metha) acrylic acid ester resin, which is formed by the polymerization. Therefore, the epoxy group of the fine particles are reacted at the same time the epoxy resin is hardened and fixed when the sealing of a semiconductor device is performed by the resin composition. Then the thermal stress is absorbed and alleviated by the fine particles, and the clouding due to poor dispersion can be prevented. Thus the semiconductor device characterized by less internal stress and excellent moisture resistance and thermal shock resistance can be obtained.</p> |
