发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To shorten a bonding time and to reduce the rate of improper bonding occurrence by not directly applying a bonding load by a drive force but applying a bonding load determined by a pressing load mechanism when a capillary is contacted with a bonding material. CONSTITUTION:A large drive force is applied by a spring 10 having a large spring constant to the first arm 7 rockably mounted through a supporting shaft 8 to operate at a high speed. When a capillary 14 is contacted with a bonding material by the drive force, a bonding load is determined by the spring 10 of a pressing load mechanism independently from the drive force of the spring 10 by the mechanism of the spring 18 provided between the first arm 7 and the second arm 11 rockably mounted through the shaft 13 to the first arm.
申请公布号 JPS61234044(A) 申请公布日期 1986.10.18
申请号 JP19860076501 申请日期 1986.04.04
申请人 HITACHI LTD 发明人 SUMIYA OSAMU;MIMATA TSUTOMU
分类号 H01L21/60 主分类号 H01L21/60
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