| 摘要 |
PURPOSE:To improve heat cycle resistance property and to simplify manufacturing processes, by providing a resin layer, which is to become a buffer zero, between a light transmitting member and a sealing resin. CONSTITUTION:At first, an EPROM element 1 is fixed on an island 3 of a lead frame by a mounting material 2 comprising epoxy paste. Then, by using a gold wire 4, the EPROM element 1 and a lead part 5 of the lead frame are wire-bonded. Then, the lead frame, on which the EPROM element 1 is mounted, is provided in a mold cavity for transfer mold. An epoxy resin 9 is injected. The resin is heated and hardened. As a result, a surface 11 of the EPROM element is exposed to the outside. A space 12 surrounded by the sealing resin is formed on the upper part. A light transmitting resin 14 comprising a silicone resin in a two-liquid mixed type is applied on the surface 11 of the EPROM element and a surface 13 of the sealing resin constituting the space 12. A light transmitting member 7 comprising alumina is provided. The device is heated at 150 deg.C for 5min and the resin is hardened. |
