发明名称 ELECTROPLATING JIG FOR SEMICONDUCTOR WAFER
摘要 PURPOSE:To fix a semiconductor wafer easily and stably on a insulating holding plate by a method wherein one side of a hooklike electrode member is fitted in the recessed part of the insulating holding plate and the other side is press- welded on the semiconductor wafer. CONSTITUTION:A recessed part is provided in a part of an insulating holding plate 2. Electrode members 1 are each constituted of a conductive elastic member having two pieces opposing to each other in a hook form. A semiconductor wafer 8 is pushed against the sides of the members 1 by a tweezers or the like along the members 5. At this time, the wafer 8 intruded between a pressure- welding part 1a and a base 1b can obtained an electrical contact with the other side of the electrode members because a resist film 10 is broken by a wave-form part 1a-w in the press welding part 1a. Moreover, the wafer 8 is stopped and fixed by positioning members 4. Thereby, the wafer 8 is fixed on the holding plate 2 easily and stably.
申请公布号 JPS62143440(A) 申请公布日期 1987.06.26
申请号 JP19850284665 申请日期 1985.12.18
申请人 NIPPON DENSO CO LTD 发明人 ITO MOTOKI;SASAKI YUKIHISA;ISHIDA NOBUMASA
分类号 H01L21/60;H01L21/67;H01L21/68;H01L21/683 主分类号 H01L21/60
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