发明名称 IC PACKAGE
摘要 PURPOSE:To provide an electronic component having a higher density and reduced size, by using a planar part in which electrically insulating magnetic body layers and coil forming conductor layers are laminated or a planar part in which dielectric layers and capacitor electrode forming conductor layers are laminated, or both of these planar, parts put one on another for providing a substrate. CONSTITUTION:A planar part 6A having a coil formed thereon comprises an insulating magnetic body or ferrite 7 within which a conductor 3 is provided in a coil shape, one end of the conductor being connected one of terminals 4A, and the other end being connected to another terminal 4A. Such arrangement may be manufactured, for example, by steps of pasting magnetic ferrite powder having high electrical insulating properties, pasting metallic powder for a coil by means of a binder, printing these pastes altenately in several layers by printing technique and calcining the same. Further, a planar part 6B having a capacitor formed therein may be manufactured by similar steps as described above, namely by depositing a dielectric 9 and a conductor 10 alternately and connecting alternate conductor layers 10 commonly to one of the terminals 4A while connecting the other conductor layers 10 commonly to another terminal 4A.
申请公布号 JPS6464240(A) 申请公布日期 1989.03.10
申请号 JP19870221028 申请日期 1987.09.03
申请人 TDK CORP 发明人 TAKATANI MINORU;MOCHIZUKI NOBUNORI
分类号 H01G4/40;H01F17/00;H01L23/12;H01L25/00;H05K3/46 主分类号 H01G4/40
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