SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To allow chips to be located at various places and transmit a power source voltage to each chip at a low impedance by providing a means to transmit the power source voltage of leads to a plurality of conductors which are located outside the chips and transmitting the power source voltage to the chips through these conductors. CONSTITUTION:A power source high voltage Vcc is transmitted from a lead 4a to a bonding pad 2a and a die pad 3b on a chip and the die pad 3b is connected to a bonding pad 2c which is located far away from the bonding pad 2a. A power source is supplied from bonding pads 2a and 2c to a power source high voltage wiring region on the chip and the effect of wiring resistance on the chip becomes small. Further, a power source low voltage Vss is supplied at a low impedance on the chip in the same manner. Capacitance C generated by the die pads 3b and 3c as well as an insulating film 6a acts as a decoupling capacitance.