发明名称 LEAD FRAME MEMBER
摘要 PURPOSE:To improve the adhesive property of an insulative film and to prevent the film from being peeled from its square parts by a method wherein the square parts of a polygon-shaped insulative substrate or the insulative film are respectively formed into the shape of a circular arc. CONSTITUTION:An insulative film 106 is formed into a quadrangle and has independent electrode patterns 107, each consisting of a prescribed number of independent electrodes, along each side of its upper surface. Each square part 106a of the film 106 is formed into a circular arc-shaped R part 108 and the starting point position (alpha) of this R part is set at a position 150mum or more apart from the end of the pattern 107 nearest the part 106a. The film 106 formed in such a way is laminated on a die pad part 104 of a lead frame member 101 with a bonding agent or the like. The film 106 is evenly heated and pressed also in each square part 106a. As a result, the film 106 is finely bonded also on each square part 106a and stops peeling from these square parts 106a.
申请公布号 JPH04144265(A) 申请公布日期 1992.05.18
申请号 JP19900268109 申请日期 1990.10.05
申请人 DAINIPPON PRINTING CO LTD 发明人 YAGI YUTAKA
分类号 H01L21/52;H01L23/50 主分类号 H01L21/52
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