| 摘要 |
The conductive paste of the invention comprises a conductive powder and a binder component, wherein the conductive powder is composed of metal powder which is copper powder or copper alloy powder partially covered on the surface with silver, and is either a mixture of roughly spherical metal powder and flat metal powder, or roughly spherical or flat metal powder alone, and wherein the binder component contains a mixture of an epoxy resin and an imidazole compound with a hydroxyl group or a mixture of an epoxy resin and an imidazole compound with a carboxyl group.
|
