发明名称 |
PLASMA TREATMENT APPARATUS AND METHOD OF PLASMA TREATMENT |
摘要 |
<p>[PROBLEMS] To not only maintain the temperature of shower plate at a desired temperature but also improve the uniformity of in-plane temperature thereof, thereby realizing inhibition of any deformation or strain generation of gas supply member and stable treatment of substrate. [MEANS FOR SOLVING PROBLEMS] The plasma treatment apparatus is one structured so as to accommodate a substrate in a treating vessel and convert a treating gas to plasma to thereby treat the substrate, wherein a gas supply member for supply of the treating gas is disposed in the treating vessel, and wherein the gas supply member thereinside is provided with a heat medium flow channel for circulation of heat medium, and wherein there is provided flow channel switching means capable of changing the direction of circulation of heat medium along the heat medium flow channel.</p> |
申请公布号 |
WO2008126595(A1) |
申请公布日期 |
2008.10.23 |
申请号 |
WO2008JP54487 |
申请日期 |
2008.03.12 |
申请人 |
TOKYO ELECTRON LIMITED;NOZAWA, TOSHIHISA;KOTANI, KOJI |
发明人 |
NOZAWA, TOSHIHISA;KOTANI, KOJI |
分类号 |
H01L21/205;C23C16/455;H01L21/3065;H05H1/46 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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