| 摘要 |
A leadframe is provided to attach a semiconductor chip to a die pad by forming four pairs of parallel surfaces and by forming inner lead connection surfaces of inner leads separated from the parallel surface by a predetermined interval wherein the inner lead connection surfaces are parallel with each other. A die pad(200) has more than three pairs of sides parallel with each other. A plurality of inner leads(300) are separated from the circumference of the die pad by a predetermined interval, radially disposed with respect to the center of the die pad wherein one ends of the inner leads form inner lead connection surfaces(301) parallel with at least one of the pairs of the sides. The sides of the die pad can form an obtuse angle. The inner lead connection surfaces can form an obtuse angle. |
