| 发明名称 |
PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART |
| 摘要 |
<p>A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.</p> |
| 申请公布号 |
EP1901123(A4) |
申请公布日期 |
2008.10.08 |
| 申请号 |
EP20060780681 |
申请日期 |
2006.06.30 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
KAWAMORI, TAKASHI;MASUKO, TAKASHI;KATOGI, SHIGEKI;YASUDA, MASAAKI |
| 分类号 |
G03F7/037;C09J7/00;C09J179/08;G03F7/004 |
主分类号 |
G03F7/037 |
| 代理机构 |
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