发明名称 Method for centering a sputter target onto a backing plate and the assembly thereof
摘要 A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced.
申请公布号 US7431195(B2) 申请公布日期 2008.10.07
申请号 US20030670460 申请日期 2003.09.26
申请人 PRAXAIR S.T. TECHNOLOGY, INC. 发明人 FACEY JOSEPH C.;WARD IVAN
分类号 B23K31/02;B23K1/00;B23K35/14;B23K35/26;C23C14/34 主分类号 B23K31/02
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