| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that prevents treatment fail due to contamination in a substrate before or after exposure treatment while suppressing a decrease in throughput, and can be miniaturized. SOLUTION: The substrate processing apparatus 500 is juxtaposed with an indexer block 10, a treatment block 11 for resist films, a cleaning/drying treatment block 12, a development processing block 13, and an interface block 14 in this order. The exposure system 15 is arranged adjacent to the interface block 14. In the exposure system 15, a substrate W is exposed to light by an immersion liquid method. Between the cleaning/drying treatment block 12 and the development processing block 13, substrate placement sections PASS5, PASS6 for transferring the substrate W between respective blocks 13, 12 are provided closely and vertically. Reversal units RT for reversing one surface and the other surface of the substrate W are arranged in lamination at the upper side of the substrate placement section PASS5 and the lower side of the substrate placement section PASS6. COPYRIGHT: (C)2008,JPO&INPIT
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