TRANSLATORY GUIDE MECHANISM, ELECTRONIC COMPONENT MOUNTING APPARATUS, AND LOAD MEASURING METHOD OF THE TRANSLATORY GUIDE MECHANISM IN THE ELECTRONIC COMPONENT MOUNTING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a translatory guide mechanism and an electronic component mounting apparatus capable of measuring an actual load applied to the translatory guide mechanism, and a load measuring method of the translatory guide mechanism in the electronic component mounting apparatus.

SOLUTION: The translatory guide mechanism guides linear motion of a linear block 9 by rotating a plurality of balls 30 between opposite ball grooves in each of a plurality of guide grooves 29a and 29b including lines of ball grooves 8a, 9a, 8b and 9b formed to be opposite in each of a linear rail 8 and the linear block 9 which are combined. A distortion gage 22 is mounted at a load measurement position specified in the ball groove of the linear block 9 to detect the bending of the ball groove by the ball 30 to measure the radial load actually working to the ball 30 by a measurement processing part 31 based on an output from the gage 22.

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