| 摘要 |
<P>PROBLEM TO BE SOLVED: To facilitate to dissipate heat generated from a semiconductor laser device, to well maintain light-emitting characteristics of the semiconductor laser device, and to perform easy operation when the semiconductor laser device is incorporated into a device and cope with a future miniaturization. <P>SOLUTION: The semiconductor laser device L including a body 1, a system 2 that is discoid or semi-discoid, is supported by the body 1, and whose support position is rotationally adjustable around the central axis, the semiconductor laser device 5 that is directly mounted or through a sub-mount 3 on the system and irradiates laser beam in parallel with a mounting surface 4, and a mirror section 6 that is mounted on the system 2 or is integrally formed therewith and reflects the reflected laser beam and releases the same to the outside. <P>COPYRIGHT: (C)2008,JPO&INPIT |
