发明名称 SANDWICH PANEL WITH EMBEDDED HEAT PIPE
摘要 PROBLEM TO BE SOLVED: To prevent a heat transfer amount to a panel from deteriorating even when electronic equipment mounted on the sandwich panel with an embedded heat pipe generates a large amount of heat. SOLUTION: A block having a cavity and the heat pipe adhere with each other by an adhesive, adhere to a skin material. After the skin is bonded in the state that the block is embedded in a core material with the sandwich panel integrally molded, a female screw hole is machined on the block to form the panel. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008194876(A) 申请公布日期 2008.08.28
申请号 JP20070030320 申请日期 2007.02.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJINAGA SHINJI
分类号 B32B3/12;B64G1/50;F28D15/02 主分类号 B32B3/12
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