| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein its heat dissipation is improved in a leaping way, and even when integrating it into such an optical component as a light guide plate, it can be driven in the state of stresses being applied to it hardly. <P>SOLUTION: The semiconductor device is the one having a semiconductor element, a lead frame wherewith the semiconductor element is connected electrically, and a package wherein it has an opening in its front plane and a portion of the lead frame is protruded from its bottom surface. Further, in this semiconductor light emitting device, the protruded lead frame so has a plurality of ends provided in a branching way as to fold the ends and as to dispose them respectively in the side and back surfaces of the package. <P>COPYRIGHT: (C)2008,JPO&INPIT |
