| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus that can directly deliver a wafer from one turning supporting device to another turning supporting device. SOLUTION: The semiconductor manufacturing apparatuses (1 and 1') are provided with a first supporting device (18), a first brush (24) to clean a wafer (30) fixed onto the first supporting device, a second supporting device (4), and second brushes (8, 11, 8', and 11') that are supported by the second supporting device to clean the wafer (30). The first supporting device turns while the wafer (30) is being fixed. The second supporting device is provided with a roller (7) that turns the wafer while being in contact with the periphery of the wafer (30). The first and second supporting devices are approximated and isolated each other. COPYRIGHT: (C)2008,JPO&INPIT |
