| 摘要 |
PROBLEM TO BE SOLVED: To obtain a Cu-Ni-Si based copper alloy sheet for electrical/electronic components in which high strength and excellent bending workability are consistent. SOLUTION: The Cu-Ni-Si based copper alloy sheet has a composition comprising, by mass, 1.5 to 4.5% Ni and 0.3 to 1.0% Si, if required, comprising one or more kinds selected from 0.01 to 1.3% Sn, 0.005 to 0.2% Mg, 0.01 to 5% Zn, 0.01 to 0.5% Mn and 0.001 to 0.3% Cr, and the balance Cu with inevitable impurities, and in which the average crystal grain size is≤10μm, the standard deviationσof the crystal grain sizes satisfies 2σ<10μm, and the abundance of the dispersed grains with the grain sizes of 30 to 300 nm present on the crystal grain boundaries is≥500 pieces/mm. COPYRIGHT: (C)2008,JPO&INPIT
|
