Mixed silicon/metal parts and associated manufacturing methods

摘要

The part has a silicon part (9) comprising a transversal cavity in which a metallic part (8) is electroformed. The electroformed metallic part assures connection between two superimposed silicon wafers, where the silicon wafers are provided in respective cavities. One of the silicon wafers is formed on a substrate, and connected on the substrate by adhesion via an intermediate photoresist layer. An independent claim is also included for a method of fabricating a metal/silicon mixed part.