发明名称 |
Substrate assembly, method of testing the substrate assembly, electrooptical device, method of manufacturing the electrooptical device, and electronic equipment |
摘要 |
The present invention provides a systems and methods to perform an electrical test on a substrate assembly used as a TFT array substrate of a liquid-crystal device without detaching a mounted external IC. The substrate assembly can include a substrate, a peripheral circuit embedded in the substrate, a first wiring arranged on the substrate, and an external IC, mounted on the substrate, and having a first terminal connected to an interconnection portion arranged on the first wiring. The substrate assembly can further include a second wiring which extends from the interconnection portion in such a manner that the second wiring is routed in a portion of the substrate facing the integrated circuit, and a first external circuit connection terminal arranged on the second wiring in a portion of the substrate not facing the integrated circuit. The external IC is thus tested through the external circuit connection terminal. |
申请公布号 |
US2007109485(A1) |
申请公布日期 |
2007.05.17 |
申请号 |
US20070651548 |
申请日期 |
2007.01.10 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
EGUCHI TSUKASA;FUJIKAWA SHINSUKE;OZAWA TOKURO |
分类号 |
G01R31/28;G02F1/1345;G02F1/13;G02F1/1368 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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