发明名称 Substrate assembly, method of testing the substrate assembly, electrooptical device, method of manufacturing the electrooptical device, and electronic equipment
摘要 The present invention provides a systems and methods to perform an electrical test on a substrate assembly used as a TFT array substrate of a liquid-crystal device without detaching a mounted external IC. The substrate assembly can include a substrate, a peripheral circuit embedded in the substrate, a first wiring arranged on the substrate, and an external IC, mounted on the substrate, and having a first terminal connected to an interconnection portion arranged on the first wiring. The substrate assembly can further include a second wiring which extends from the interconnection portion in such a manner that the second wiring is routed in a portion of the substrate facing the integrated circuit, and a first external circuit connection terminal arranged on the second wiring in a portion of the substrate not facing the integrated circuit. The external IC is thus tested through the external circuit connection terminal.
申请公布号 US2007109485(A1) 申请公布日期 2007.05.17
申请号 US20070651548 申请日期 2007.01.10
申请人 SEIKO EPSON CORPORATION 发明人 EGUCHI TSUKASA;FUJIKAWA SHINSUKE;OZAWA TOKURO
分类号 G01R31/28;G02F1/1345;G02F1/13;G02F1/1368 主分类号 G01R31/28
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