| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component mounting substrate for effectively utilizing conductor particle while attaining sufficient conductivity without reduction in size of electronic component and leak or short-circuit due to high density mounting. <P>SOLUTION: Anisotropic conductive materials 18, 18 are formed to fill an aperture hole 16 by forming this aperture hole 16, at the location where an electric contact 17a of an electronic component 17 is electrically in contact with a conductive film 12. Consequently, the electronic component 17 is electrically connected to the predetermined location of the conductive film 12 via the anisotropic conductive materials 18, 18. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
