发明名称 Method and device for connecting chips
摘要 The invention relates to an electronic device comprising: a circuit, comprising a first and a second face, the first face being provided with electrical connection means, a transfer element, comprising a first face and a second face, and being assembled to the second face of the active element through its first face, and comprising electrical connection means on its second face, a connection between the electrical connection means of the active element and the electrical connection means of the transfer element.
申请公布号 US2007111567(A1) 申请公布日期 2007.05.17
申请号 US20040577142 申请日期 2004.10.28
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE 发明人 MARION FRANCOIS
分类号 H01R13/648;H01L21/60;H01L21/603;H01L23/31;H01L25/18;H01L27/148 主分类号 H01R13/648
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