SEMICONDUCTOR PACKAGE WITH CHIP PACKAGE INSERTED IN SUBSTRATE,申请号KR20040113152-传众专利搜索

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发明名称	SEMICONDUCTOR PACKAGE WITH CHIP PACKAGE INSERTED IN SUBSTRATE
摘要
申请公布号	KR20060074421(A)	申请公布日期	2006.07.03
申请号	KR20040113152	申请日期	2004.12.27
申请人	DONGBU ELECTRONICS CO., LTD.	发明人	LEE, KWAN YUL
分类号	H01L23/04;H01L23/00	主分类号	H01L23/04
代理机构		代理人
主权项
地址

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