| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To incorporate various characteristics to protect MEMS elements from an impact by external force, in packaging of the MEMS device. <P>SOLUTION: Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate 101, an interferometric modulation display array 111 formed on the substrate 101, and a back-plate 130. The back-plate is placed over the display array 111 with a gap 124 between the back-plate and the display array. The depth of the gap varies across the back-plate. The back-plate can be curved or have a recess on its interior surface facing the display array. Thickness of the back-plate can be varied. The device can include reinforcing structures which are integrated with the back-plate. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
